Molex Silver Flexible Circuit Solutions are a flexible alternative. With the ability to print up to six layers and component SMT, Silver Flex offers an economical approach to traditionally etched copper products.

Polyester (PET) substrate:
• Provides a flexible substrate alternative
• More cost-effective than polyimide

Proprietary soldering technique:
• Supports attachment of fine-pitch (0.50mm) microprocessor-based components (ICs) on PET with traditional SMT processes

UV-cured encapsulant:
• Protects solder joints, enabling them to withstand vibration and mechanical shock
• Offers robust connection that tolerates a wide variety of applications

Does not require harsh chemicals or a waste treatment facility:
• Offers an environmentally friendly component

Traces as narrow as 0.127mm (5.0 mils) and spacing as small as 0.127mm (5.0 mils), with the capability of even narrower and more finely spaced traces in select designs:

• Delivers low resistance and high conductivity, making this an effective circuit for a wide variety of low-power and -signal applications