For aerospace, defense and industrial electronic assemblies, minimizing space and weight while maintaining signal integrity is a constant challenge. Designers require high-density, solderless interconnect solutions that reduce board stack heights, simplify assembly and maintain reliable electrical performance under demanding operational conditions. As such, stackable connectors that support modular system architectures and customized signal routing are critical for optimizing complex multi-board assemblies.
AirBorn RC Series Stackable Connectors provide a high-density, solderless solution with 0.075" contact spacing, delivering significant space and weight savings. Press-fit compliant contacts eliminate soldering and inspection processes while supporting selectively loaded contacts for tailored signal routing. These features reduce assembly complexity, lower production costs, and improve electrical performance and system reliability.
Available in low and full profile configurations with 28 to 300 contacts, the RC Series supports a wide range of board stacking and cable-to-board architectures. Various hardware options and contact tail lengths accommodate different stack heights, enabling complex multi-stack designs while maintaining consistent alignment and low-stress termination for long-term reliability.