At Molex, we take a multidimensional approach to develop complete, integrated solutions that turn your ideas into reality. With the industry's broadest printed electronics capabilities and the expertise to develop solutions that solve your electromechanical challenges, we can advise you on the best fit for your needs, balancing performance, durability, weight, scalability and other requirements.
Molex printed electronics capabilities utilize highly scalable printing and converting processes, including laser-cutting, die-cutting and lamination. With traces as narrow as 0.127mm (0.005"), Molex can help you achieve the circuit density and form factor you need for your application.
Coupled with our printed electronics capabilities, Molex engineers developed a world-class method to solder components to silver inks on polyester substrates, allowing electronics to flex and bend to fit into tight spaces. We have streamlined our process to boost reliability, even in the most challenging conditions. These combined printing and SMT capabilities enable best-in-class FHE solutions for our customers.
