With the exponential growth of The Internet of Things (IoT), cloud computing and 5G wireless communications that require ever-greater data speeds and bandwidth, data centers are facing constant increases in demand. To provide a future-proof service, data center architecture needs to be flexible and the power supply infrastructure must grow in parallel.
As more processors are being packed into server racks, delivering power to meet the increasing needs of the data center requires greater power density than ever before. Power supplies and their connectors must be able to deliver more power per inch of rack space.
Modern high-speed processors depend on a flow of power free from surges and spikes that might be caused by external interference. This is provided by Uninterrupted Power Supply (UPS) systems that provide the clean power that servers require. They also provide a short-term emergency supply in the event of power outages.
All this equipment generates a large amount of heat that is detrimental to the efficient performance of the data center. This is especially important in data centers as high temperatures have a detrimental impact on the signal integrity that is so important to high-speed communications. Therefore, considerable attention must be devoted to thermal management, including everything from creating an efficient design that ensures the clean flow of cooling air to supplying power for cooling systems.
Connectors that are destined for data center applications must be designed to provide the greatest efficiency. Energy lost to electrical resistance not only increases operating costs but also contributes to an increased thermal load. Molex brings expertise in the field of high-power connectors, enabling you to achieve the best possible performance for your data center application.
