Product Highlights
| Outer Diameter (OD): | Insulation: | Wire AWG: |
|---|---|---|
| Tight Wall Tolerance: Down to 5% wire OD | Pin-Hole-Free Insulation (FEP, PFA, ETFE) | 36 - 52 |
Features and Benefits
Overview
Temp-Flex Micro Extrusion Primary Wires enable customers to develop surgically implantable leads that can be densely packaged for a variety of medical applications. The wire insulation is applied by a precise extrusion process that results in superior dielectric integrity compared to other technologies.
This process simultaneously encapsulates the wire, providing a consistent and uniform coating. In addition, the process provides a pin-hole-free insulation, resulting in limited risk of conductor exposure and provides a more reliable insulation versus dispersion or enamel coatings.
Applications
MedTech:
Cardiac rhythm management
Catheters
Cochlear implants
Deep brain stimulation
Defibrillators
Endoscopic applications
Invasive probes
Neurological therapies
Pacemakers
Pain management
Spinal cord stimulation
This is not a definitive list of applications for this product. It represents some of the more common uses.